By reactive magnetron sputtering of a pure Cu and a pure Al, Fe, La target, Cu₃N film and Cu-Al-N, Cu-Fe-N, Cu-La-N films were prepared on glass, respectively, at 0.5 Pa N₂ partial pressure and 100℃ substrate temperature. X-ray diffraction measurements showed that Cu₃N film was composed of Cu₃N crystallites with anti-ReO₃ structure and prefer to be [111]-oriented. The Al-doped copper nitride film (Cu-Al-N) with very weak diffraction peak preferred to being [111]-oriented, too. XRD showed that the Fe-doped copper nitride film (Cu-Fe-N) and the La-doped copper nitride film (Cu-La-N) were amorphous. The resistivities of Cu-X-N films (X=Al, Fe and La) were higher than that of Cu₃N film.